Taiwan Semiconductor Manufacturing (NYSE: TSM) — Company Overview, News & Financial Data
Taiwan Semiconductor manufactures semiconductors and integrated circuits, targeting key advancements in chip design.
Taiwan Semiconductor Manufacturing
Taiwan Semiconductor Manufacturing is a pure-play semiconductor foundry that manufactures integrated circuits and semiconductor devices for global technology companies. Founded in 1987 and headquartered in Hsinchu, Taiwan, the company designs and manufactures advanced logic process technologies, specialty technologies, and advanced packaging solutions. Its manufacturing footprint includes multiple GIGAFAB facilities in Taiwan alongside manufacturing operations and joint ventures in the United States, Japan, and China. The company serves fabless semiconductor companies and integrated device manufacturers across key market segments including high-performance computing, smartphones, automotive electronics, internet of things, and digital consumer electronics.
Snapshot
Operations
Products and/or services of Taiwan Semiconductor Manufacturing
- Advanced Logic Node Manufacturing: Manufacturing of leading-edge logic integrated circuits utilizing advanced process nodes from 7-nanometer down to 2-nanometer and A16 architectures. Production spans high-volume fabrication facilities supplying central processors and graphics chips for mobile and high-performance computing markets.
- Specialty Process Technologies: Production of specialized semiconductor devices including microelectromechanical systems, complementary metal-oxide-semiconductor image sensors, embedded memory, analog chips, power management integrated circuits, and radio frequency technologies built on mature process nodes across dedicated fabrication sites.
- Advanced Packaging and 3D Integration: Provision of backend semiconductor assembly and advanced packaging services, including chip-on-wafer-on-substrate, integrated fan-out, and three-dimensional integrated circuit stack architectures. Operations integrate multiple die into high-density system-in-package configurations for advanced artificial intelligence hardware.
- GIGAFAB Manufacturing Facilities: Operation of large-scale manufacturing complexes located in Hsinchu, Tainan, and Taichung, Taiwan. These facilities deliver high-volume semiconductor fabrication capacity, producing hundreds of thousands of twelve-inch silicon wafers monthly across multiple advanced node technologies.
- International Fabrication Operations: Deployment of overseas manufacturing facilities, including semiconductor fabrication plants in Arizona, United States, Kumamoto, Japan, and Nanjing, China. These international sites expand global production capacity for advanced and mature process technologies across regional markets.
- Photomask and Design Ecosystem Services: Delivery of photomask manufacturing, electronic design automation integration, semiconductor intellectual property libraries, and multi-project wafer shuttle services. These services enable customers to design, verify, and prototype complex integrated circuits prior to volume manufacturing.
Taiwan Semiconductor Manufacturing executive team
- C. C. WeiChairman & CEO
- Jen-Chau HuangSenior VP, CFO & Spokesperson
- Y. P. ChynExecutive VP & Co-COO
- Y. J. MiiExecutive VP & Co-COO
- Min CaoVP of Research, Development, Pathfinding & Corporate Research and CTO
- Horng-Dar LinVice President of Corporate Information Technology & Chief Information Officer
- Jeff SuDirector of Investor Relations
- Sylvia FangSenior VP, General Counsel & Corporate Governance Officer
- Pei-Hong ChenVice President of the Human Resources
- Wei-Jen LoSenior Vice President of Corporate Strategy Development
Latest news about Taiwan Semiconductor Manufacturing
TSMC demands operational control in Terafab talks
United StatesTSMC delivers record Q3 profit of $23.55 billion
United StatesTSMC Q3 revenue jumps 51% to NT$1.49 trillion
United StatesIntel gains after report says it remains involved in Musk’s Terafab project
United StatesTSMC shares reaches record high on Terafab talks
United StatesAsian shares rise ahead of Trump Xi talks
United States
Dividend history
Dividends per share paid by Taiwan Semiconductor Manufacturing, by financial year.
| Financial year | Interim | Final | Special | Total |
|---|---|---|---|---|
| FY2026(to date) | — | — | — | $3.7144 |
| FY2025 | — | — | — | $2.6787 |
| FY2024 | — | — | — | $1.9680 |
| FY2023 | — | — | — | $1.8462 |
| FY2022 | — | — | — | $1.8509 |
Key financials
Reported results for Taiwan Semiconductor Manufacturing, in TWD.
- Market cap
- 2.2T
- Revenue (TTM)
- 4.9T
- P/E ratio
- 28.0
- EPS (diluted, TTM)
- 15.4
- Dividend yield
- 0.9%
- Profit margin
- 51.1%
| Fiscal year end | Revenue | Operating income | Net income |
|---|---|---|---|
| 3.8T | 1.9T | 1.7T | |
| 2.9T | 1.3T | 1.2T | |
| 2.2T | 921.5B | 851.7B | |
| 2.3T | 1.1T | 992.9B |