ASE Industrial Holding Co (ASX: ASX) — Company Overview, News & Financial Data
ASE Industrial specializes in semiconductor manufacturing, providing a full suite of end-to-end services for integrated circuits.
ASE Industrial Holding Co
ASE Industrial Holding Co is a provider of semiconductor packaging and testing services and electronic manufacturing services. Formed through the combination of Advanced Semiconductor Engineering and Siliconware Precision Industries, alongside Universal Scientific Industrial, the company offers comprehensive turnkey solutions including wafer bump, wafer probe, advanced packaging, IC testing, and system-in-package module design and assembly. Its global manufacturing and service network spans Taiwan, mainland China, South Korea, Japan, Malaysia, Singapore, Mexico, Europe, and the United States, serving major integrated device manufacturers, fabless semiconductor companies, and technology brand owners worldwide.
Snapshot
Operations
Products and/or services of ASE Industrial Holding Co
- Advanced Semiconductor Packaging: Turnkey semiconductor assembly solutions including flip-chip, fan-out wafer-level packaging, 2.5D and 3D IC integration, high-density substrate packaging, and co-packaged optics designed for high-performance computing, artificial intelligence, automotive, and mobile communications applications.
- Semiconductor Testing Services: Comprehensive IC testing capabilities spanning wafer-level probing, final testing, burn-in testing, and system-level testing across analog, digital, mixed-signal, radio frequency, and memory integrated circuits across global testing facilities in Asia.
- Electronic Manufacturing Services: Full-service electronic assembly and module manufacturing providing system-in-package solutions, printed circuit board assemblies, and sub-systems for automotive electronics, cloud storage, wireless communication, consumer electronics, and industrial automation equipment across international facilities.
- Traditional Leadframe and Substrate Assembly: Standard IC packaging services including wire bonding, quad flat package, dual flat no-lead, and ball grid array technologies for microcontrollers, power management integrated circuits, sensors, and legacy semiconductor components.
- Wafer-Level Services and Bumping: Front-end wafer processing support featuring copper pillar bumping, solder bumping, redistributed layer processing, and wafer thinning and dicing to prepare semiconductor wafers for advanced flip-chip and 3D assembly.
- System Integration and Module Solutions: Integration of multiple integrated circuits, passive components, and sensors into compact system-in-package modules for wearable electronics, wireless connectivity modules, edge computing devices, and automotive sensor platforms.
ASE Industrial Holding Co executive team
- Mr. Hung-Pen ChangVice Chairman, GM & President
- Mr. Joseph TungGroup Chief Financial Officer
- Dr. Tien Yu WuGroup COO & Representative Director
- Mr. Murphy KuoSenior VP, Chief Accounting Officer & Group Controller
- Mr. Du-Tsuen UangChief Administration Officer & Chief Corporate Governance Officer
- Mr. Kenneth Hsiang CPAHead of Investor Relations & Senior VP
- Ms. Anne ChangSenior Vice President of Sales & Marketing
- Dr. Shi Hua PanGroup Chief of Staff
- Mr. Rui Rong LoGM of Kaohsiung Plant
- Mr. Kwai Mun LeePresident of Southeast Asia Operations