Micron completes Tongluo site acquisition to boost HBM production

Micron Technology (NASDAQ:MU) announced on March 15, 2026, the formal completion of its acquisition of the P5 Tongluo site from Powerchip Semiconductor Manufacturing (PSMC).

The transaction, valued at approximately $1.8 billion, adds an existing 300,000-square-foot 300mm cleanroom to Micron’s vertically integrated mega campus in Taichung, located roughly 15 miles away.

The Boise, Idaho-based memory leader will begin retrofitting the facility this month to prepare for the production of leading-edge DRAM, specifically high-bandwidth memory (HBM).

While the infrastructure is already in place, Micron expects meaningful product shipments from the retrofitted fab to commence in fiscal 2028.

This phased ramp-up is part of a broader strategy to address what the company describes as the most severe supply constraints in the memory industry in decades, fueled by the rapid growth of AI infrastructure.

In tandem with the acquisition, Micron unveiled plans for a second phase of expansion at the Tongluo site.

The company intends to break ground on a new, comparable facility of approximately 270,000 square feet by the end of fiscal 2026.

This second cleanroom will further consolidate Micron's manufacturing footprint in Taiwan, which currently serves as a central hub for its most advanced memory technologies.