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Nanoveu secures US patent for object detection chip
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Nanoveu secures US patent for object detection chip

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  • Nanoveu's ultra-low-power semiconductor division EMASS has been granted US Patent No. 12,651,452 B2 for its AI object detection technology.
  • The patented hardware accelerator delivers speedups of up to 75 times over traditional software implementations.
  • The innovation aims to support edge devices, including smart cameras, wearables, drones, and automotive sensors.

Nanoveu (ASX:NVU) announced that Nanyang Technological University, Singapore, has been granted US Patent No. 12,651,452 B2, which is exclusively licensed to Nanoveu's semiconductor division, EMASS.

The technology shifts non-maximum suppression—a crucial AI object detection process—from standard software into dedicated silicon to remove processing bottlenecks in edge devices.

Research underlying the patent indicates that the dedicated hardware module achieves up to 75 times faster speed-ups over software implementations and a 13.4 times improvement over prior accelerators at full-HD resolution.

"The exclusive licence puts that mechanism in EMASS’s hands, and we intend to follow the same path from research to protected silicon across voice, motion and sensor fusion," stated Dr Mohamed Sabry, founder of EMASS.

The company stated that the patented mechanism is implemented in its 16nm ECS-DoT chip, which entered fabrication at TSMC in January.

Following the announcement, the Nanoveu share price was unchanged at $0.061.

Nanoveu is a technology company specialising in advanced semiconductors, visualisation platforms, and materials sciences.

The company plans further patent filings across voice, motion, and sensor fusion workloads to expand its intellectual property portfolio.

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