Nanoveu receives first 16nm silicon chips from TSMC
- Nanoveu subsidiary EMASS received initial engineering samples of its 16nm ECS-DoT edge AI system-on-chip from foundry partner TSMC.
- The arrival allows the engineering team to commence physical bring-up, benchmarking, and characterisation testing across edge AI workloads.
- The 16nm chip expands the company's product suite alongside its existing 22nm node to address broader ultra-low-power markets.
Nanoveu (ASX:NVU) announced that its subsidiary Embedded A.I. Systems received physical silicon samples of its 16nm ECS-DoT edge AI chip from Taiwan Semiconductor Manufacturing Company.
The shipment follows technical progress through design sign-off in December 2025 and fabrication entry in January 2026.
Director of Nanoveu and Founder of EMASS, Dr Mohamed Sabry, said, "We have reached that moment with the 16nm ECS-DoT. It carries everything we set out to build: the radio, the memory, the power fabric, the detection engine and the FPU, on one die at 16nm.”
The 16nm chip features a Bluetooth Low Energy subsystem, expanded SRAM, a patented object-detection accelerator, and a hardware floating-point unit built on TSMC's 16nm FinFET process.
The company will publish performance results after benchmarking while evaluating smaller process nodes for future product generations.
Following the announcement, the Nanoveu share price was up at $0.060.
The company operates a two-node product strategy combining the new 16nm chip with its commercially available 22nm ECS-DoT processor running on a shared software toolchain.
