Nanoveu raises $7.5M to launch EMASS ECS-DoT chip platform

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Nanoveu raises $7.5M to launch EMASS ECS-DoT chip platform
Nanoveu raises $7.5M to launch EMASS ECS-DoT chip platform
Mahathir Bayena
Written by Mahathir Bayena
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Nanoveu (ASX:NVU), an Australian technology innovator in semiconductors and advanced materials, has raised $7.5 million through a share placement to fund the commercialisation of its EMASS ECS-DoT system-on-chip platform.

The placement, priced at $0.088 per share, attracted both new and existing sophisticated, professional, and institutional investors.

Nanoveu’s directors have committed $120,000 to participate, subject to shareholder approval.

The funds will support the 16nm ECS-DoT tape-out, live drone testing, and broader rollout of Nanoveu’s commercial SoC platform, as well as ongoing development of its EyeFly3D drone technology and Nanoshield solar coatings.

EMASS has delivered the final 16nm ECS-DoT GDS into the TSMC/IMEC workflow, advancing through technical verification and bug checking, with tape-out readiness achieved in just six months—a pace significantly faster than typical advanced-node SoC development.

In parallel, live drone validation is underway in collaboration with a US drone specialist, building on Phase 2 simulation results that demonstrated over 50% endurance improvements across quadcopter, hexacopter, and octocopter platforms.

Early real-world flight tests are expected to confirm these gains later this quarter.

Executive Chairman Dr. David Pevcic said the funding positions Nanoveu to convert technical momentum into commercial outcomes, scaling both the existing 22nm platform and next-generation 16nm ECS-DoT.

At the time of reporting, Nanoveu's share price was $0.092.

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