Nanoveu (ASX:NVU), an Australian technology innovator in semiconductors and advanced materials, has raised $7.5 million through a share placement to fund the commercialisation of its EMASS ECS-DoT system-on-chip platform.
The placement, priced at $0.088 per share, attracted both new and existing sophisticated, professional, and institutional investors.
Nanoveu’s directors have committed $120,000 to participate, subject to shareholder approval.
The funds will support the 16nm ECS-DoT tape-out, live drone testing, and broader rollout of Nanoveu’s commercial SoC platform, as well as ongoing development of its EyeFly3D drone technology and Nanoshield solar coatings.
EMASS has delivered the final 16nm ECS-DoT GDS into the TSMC/IMEC workflow, advancing through technical verification and bug checking, with tape-out readiness achieved in just six months—a pace significantly faster than typical advanced-node SoC development.