DorsaVi begins chip manufacturing process

• DorsaVi commences the tape-out process for its first integrated validation chip, transitioning the technology from design to physical manufacturing.
• The announcement on July 15 coincided with an 11.54% rise in the company's stock price during the trading session.
• The manufacturing pathway aims to prove standard foundry compatibility and secure future 22-nanometre commercial scaling.

DorsaVi (ASX:DVL) has commenced the tape-out process for its first resistive random-access memory and complementary metal-oxide-semiconductor validation chip.

The milestone transitions the 22-nanometre development programme from a completed design package into staged physical silicon manufacturing.

“Commencing the tape-out of our first RRAM test chip is a significant milestone for the programme," said dorsaVi Group CEO Mathew Regan.

This staged manufacturing process utilises commercial complementary metal-oxide-semiconductor front-end wafers sourced through TSMC.

Following the announcement, the dorsaVi share price was up 11.54% at $0.029.

The validation chip is designed to generate practical data on memory array operation, write-and-verify behaviour, and compute-in-memory functionality.

The testing phase is intended to guide future circuit optimisation and support the company's broader roadmap for low-power edge intelligence.