Rambus (NASDAQ: RMBS) — Perfil da empresa, notícias e dados financeiros
Rambus develops chips and silicon IP, focusing on high-speed memory architectures and security technology.
Rambus
Rambus is a semiconductor IP and chip provider that designs high-speed memory interface chips, interface IP, and security IP for data center, artificial intelligence, automotive, and cloud computing applications. Headquartered in San Jose, California, the company develops technologies including DDR5 and DDR4 memory DIMM chipsets, PCIe, CXL, and HBM interface controllers, alongside hardware-based root of trust security IP. Its products enable increased memory bandwidth, enhanced data throughput, and secure operations across server, client, and edge infrastructure globally.
Resumo
Operações
Produtos e/ou serviços de Rambus
- Server Memory Interface Chips: High-performance memory DIMM chipsets, including DDR5 and DDR4 Registering Clock Drivers (RCD), Power Management ICs (PMIC), and SPD Hubs designed for enterprise servers and AI data center infrastructure.
- Interface Silicon IP: Comprehensive physical (PHY) and controller interface IP solutions, including PCI Express, Compute Express Link (CXL), High Bandwidth Memory (HBM), and GDDR protocols for advanced computing architectures and chiplet integrations.
- Security Silicon IP: Hardware-based security solutions featuring silicon Root of Trust cores, inline memory encryption modules, quantum-safe cryptography engines, and secure networking IP to protect data at rest, in use, and in motion.
- Client Memory Interface Chips: Integrated memory interface integrated circuits, including DDR5 and LPCAMM2 client DIMM chipsets engineered to optimize memory bandwidth, timing, and latency in personal computing devices and notebook systems.
- Provisioning and Key Management Services: Specialized security software toolkits, anti-counterfeiting systems, and key management services enabling secure device lifecycle management, differential power analysis countermeasures, and trusted IoT device provisioning.
- Patent and Technology Licensing: Architectural technology licensing and patent portfolios covering high-speed interface and memory architectures, providing proprietary semiconductor design solutions and royalty-bearing technology access to global chipmakers and system OEMs.
equipe executiva do Rambus
- Luc SeraphinCEO, President & Director
- Xianzhi FanEVP & COO
- John P. ShinnSenior VP, General Counsel, Chief Compliance Officer & Secretary
- Sumeet GagnejaSenior VP & CFO
- William Taulbee IIVP & Chief Accounting Officer
- Shyam RamachandranSenior VP & Chief Information Officer
- Kit RodgersSenior Vice President of Technology Partnerships & Corporate Development
- Cliff BurnetteSenior VP & Chief Human Resources Officer
- Simon Blake-WilsonSenior VP & GM of Silicon IP
- Jeffry MooreSenior Vice President of Global Operations
Histórico de dividendos
Dividendos por ação pagos pela Rambus, por ano fiscal.
| Ano fiscal | Intermediário | Final | Especial | Total |
|---|---|---|---|---|
| FY2026(até o momento) | — | A$0.1050 | — | A$0.1050 |
Principais indicadores financeiros
Resultados divulgados pela Rambus, em USD.
- Cap. de mercado
- 9,6 bi
- Receita (TTM)
- 756,3 mi
- P/L
- 36.7
- LPA (diluído, TTM)
- 2.4
- Dividend yield
- —
- Margem de lucro
- 31.7%
| Fim do ano fiscal | Receita | Resultado operacional | Lucro líquido |
|---|---|---|---|
| 707,6 mi | 260,2 mi | 230,5 mi | |
| 556,6 mi | 179 mi | 179,8 mi | |
| 461,1 mi | 91,5 mi | 333,9 mi | |
| 454,8 mi | 80,1 mi | -14,3 mi |