Amkor Technology (NASDAQ: AMKR) — Perfil da empresa, notícias e dados financeiros
Amkor Technology provides semiconductor packaging and test services, advancing technology for diverse industries globally.
Amkor Technology
Amkor Technology is a provider of outsourced semiconductor packaging and test services. Founded in 1968, the company offers design, assembly, advanced packaging, and testing solutions to integrated device manufacturers, fabless semiconductor companies, and contract foundries. Its packaging services encompass flip chip, system-in-package, wafer-level packaging, wirebond laminate, and leadframe technologies, serving industries such as automotive, communications, computing, consumer electronics, industrial, and artificial intelligence. Headquartered in Tempe, Arizona, Amkor operates manufacturing plants, research facilities, and sales offices across Asia, Europe, and the Americas, including major production sites in South Korea, China, Taiwan, Japan, Malaysia, the Philippines, Portugal, and Vietnam.
Resumo
Operações
Produtos e/ou serviços de Amkor Technology
- Advanced Packaging Services: Wafer-level and high-density packaging architectures, including 2.5D/3D TSV, flip chip, high-density fan-out, and S-SWIFT technologies, providing interconnect solutions for artificial intelligence, high-performance computing, and mobile processors across facilities in Asia and North America.
- System in Package Integration: Integration of multiple integrated circuits, passives, and optical components into unified modules for mobile communication, automotive electronics, and IoT applications, combining RF, power management, and digital chips into compact form factors.
- Laminate Packaging Solutions: High-density substrate-based semiconductor packaging services, including FCBGA, PBGA, and stacked chip-scale packages, supporting microprocessors, graphics processing units, and networking chips with high pin-counts and complex routing requirements.
- Semiconductor Test Services: Comprehensive wafer probe, final electrical test, strip testing, and thermal characterization services, operating testing platforms and automated handling equipment across major production campuses in South Korea, Taiwan, China, and the Philippines.
- Leadframe Packaging Services: Traditional wirebond leadframe assembly services, including quad flat packages and micro leadframe packages, utilized for power management units, analog integrated circuits, and sensor chips in automotive, industrial, and consumer markets.
- Automotive and Power Packaging: High-reliability packaging solutions for automotive electronic control units, silicon carbide power modules, and discrete devices, produced in automotive-certified facilities in Europe, Japan, South Korea, and Southeast Asia.
equipe executiva do Amkor Technology
- Susan Y. KimChairman
- Kevin K. EngelCEO, President & Director
- Megan FaustExecutive VP, CFO & Treasurer
- Mark N. RogersExecutive VP, General Counsel & Corporate Secretary
- Farshad HaghighiExecutive VP & Chief Sales Officer
- John Don LiuExecutive Vice President, Corporate Development & Strategy
- Cherie BuntynSenior VP & Chief Accounting Officer
- Jennifer JueVice President of Investor Relations & Finance
- JinAn LeeExecutive Vice President of Worldwide Manufacturing
Últimas notícias sobre a Amkor Technology
Histórico de dividendos
Dividendos por ação pagos pela Amkor Technology, por ano fiscal.
| Ano fiscal | Intermediário | Final | Especial | Total |
|---|---|---|---|---|
| FY2026(até o momento) | — | — | — | $0.2515 |
| FY2025 | — | — | — | $0.3330 |
| FY2024 | — | — | — | $0.7250 |
| FY2023 | — | — | — | $0.3040 |
| FY2022 | — | — | — | $0.2250 |
Principais indicadores financeiros
Resultados divulgados pela Amkor Technology, em USD.
- Cap. de mercado
- 9,9 bi
- Receita (TTM)
- 7,5 bi
- P/L
- 17.9
- LPA (diluído, TTM)
- 2.2
- Dividend yield
- 0.0%
- Margem de lucro
- 7.4%
| Fim do ano fiscal | Receita | Resultado operacional | Lucro líquido |
|---|---|---|---|
| 6,7 bi | 467,4 mi | 373,9 mi | |
| 6,3 bi | 438,5 mi | 354 mi | |
| 6,5 bi | 470,3 mi | 359,8 mi | |
| 7,1 bi | 897,2 mi | 765,8 mi |