Micron Technology (NASDAQ:MU) broke ground on a new advanced wafer fabrication facility in Singapore, a strategic expansion with a planned investment of approximately $24 billion (SG$31 billion) over the next 10 years.
The facility will add up to 700,000 square feet of cleanroom space within Micron’s existing NAND complex, complementing an ongoing high-bandwidth memory (HBM) advanced packaging facility expected to contribute to HBM supply starting in calendar 2027.
Wafer output from the new fab is scheduled to begin in the second half of 2028.
The project is projected to create about 1,600 jobs, bringing the total employment impact from Micron’s recent Singapore investments to approximately 3,000 positions.
The investment underscores Micron’s long-term strategy to strengthen its global manufacturing footprint in high-demand memory markets, particularly for NAND and advanced memory solutions critical to AI, data centers, and consumer electronics.
Management highlighted Singapore’s supportive ecosystem, skilled workforce, and stable business environment as key factors in the decision.