Taipei, Taiwan-based ASE Technology Holding (NYSE:ASX), a leading provider of semiconductor packaging, assembly, testing, and materials services, reported unaudited consolidated net revenues for January 2026 to meet Taiwan regulatory requirements.
Consolidated net revenues totaled NT$59,989 million (US$1,906 million), rising 1.9% sequentially from December 2025 and 21.3% year-over-year from January 2025.
Net revenues from ATM (assembly, testing, and materials) were NT$37,639 million (US$1,196 million), essentially flat sequentially but increasing 33.8% year-over-year in NT$ terms (39.5% YoY in US$ terms), reflecting continued strength in advanced packaging demand.
The jump in year-over-year performance coincides with ASE’s aggressive pivot toward its "LEAP" (Leading-Edge Assembly and Packaging) services.
Last week, the company announced a target to double its LEAP revenue to $3.2 billion in 2026, driven by unprecedented demand for 2.5D and 3D stacking technologies required for NVIDIA and AMD’s latest AI GPUs.
Industry analysts suggest that as internal capacity at major foundries remains constrained, ASE has emerged as the indispensable "second supply chain" for hyperscalers and chip designers.