Tower Semiconductor ships AI optical chips
- Tower Semiconductor (NASDAQ:TSEM) and NewPhotonics began high-volume shipments of optical engine photonic integrated circuits for AI data-center connections.
- The NPG102 PIC devices support data rates from 800G to 1.6T using 200G-per-lane designs.
- The companies are targeting next-generation AI infrastructure applications, including optical networking solutions for data centers.
Tower Semiconductor (NASDAQ:TSEM) and NewPhotonics announced the start of high-volume shipments of laser-integrated, serviceable optical engine photonic integrated circuits (PICs) designed for AI data-center interconnects.
The NPG102 PIC devices support data rates ranging from 800G to 1.6T and use 200G-per-lane designs with heterogeneously integrated lasers built on Tower Semiconductor’s PH18DA silicon photonics platform.
The devices are designed for FRO, LRO and LPO optical modules, Extra-Dense Packaged Optics pluggable modules and Near-Packaged Optics socket pluggable solutions, while CPX-MSA compliant NPC505 chipsets for 6.4T NPO applications are planned for volume shipments in the first half of 2027.
Tower Semiconductor provides semiconductor manufacturing services for customers across industries, including silicon photonics, analog, mixed-signal and other specialized chip technologies.
NewPhotonics develops optical interconnect technologies focused on high-speed data transmission, with its products targeting applications in AI computing infrastructure and data-center networking.
