Camtek (NASDAQ:CAMT) today announced that it has received more than $50 million in initial orders for its new Hawk product, a state-of-the-art platform designed to revolutionize the advanced semiconductor packaging market.
These orders, spanning several customers, are expected to be fulfilled throughout 2025, with additional orders in the pipeline.
The Hawk platform represents a significant leap forward for Camtek, addressing the high-end needs of advanced packaging technologies, including 3D wafer inspection, High Bandwidth Memory (HBM), Chiplet integration, and Hybrid Bonding.
With a unique ability to measure wafers with up to 500 million micro bumps, the Hawk offers enhanced precision and throughput compared to Camtek’s previous Eagle product line, positioning it to meet the growing demands of the semiconductor industry.
The product will officially launch at Semicon Korea in February 2025, with Camtek aiming to solidify its leadership position in the fast-evolving semiconductor sector.
The Hawk platform is expected to meet the rigorous demands of next-generation semiconductor manufacturing, delivering unprecedented accuracy and speed for critical applications in chip packaging.